Based on LCP nonwoven fabric, it is a flexible conductive material processed by the continuous electroless copper-nickel plating, single/double side coated with conductive adhesive and release paper, featured by ultra-thin, highly conductive, electromagnetic shielding, die-cut adaptation, widely used in 5G base stations, flexible displays, TWS headphones and AI-powered computing temperature resistance.

Conductive nonwoven fabric samples

Core Parameters (Sample Specification)

· Base material: LCP nonwoven fabric (T 3 – 100 μ m, W 3 – 100 g/㎡)

· Metal layer: Cu + Ni (T 0.01 – 0.1 μ m), surface resistance ≤20 M Ω/ □

· Spec.: W 1050mm ± 10mm, L 2000m/roll, T 0.015 – 0.4mm (tolerance ± 0.005mm)

Core Strengths

1. Ultra-thin bendable： The thinnest is 9 μ m, repeatedly bent for 10000 times without obvious resistance change.

2. High consistency： Thickness tolerance ±0.01mm, W CV value ≤3%, suitable for precision die cutting .

3. Environment: The 72-hour shrinkage is ≤0.3% at 85℃ ×85% RH, salt spray resistance ≥48 hours.

Application:  5G base stations, flexible displays, TWS headphones and AI-powered computing temperature resistance.

Confidential and not for public disclosure........