CMP Polishing Pad

The CMP process is a combination of surface chemistry and mechanical grinding techniques to achieve micron/nanometer level removal of different materials from the wafer surface, resulting in nanometer level flattening of the wafer surface to allow the next lithography process to proceed.

High-end Conductive Nonwoven Fabric Series

Based on LCP nonwoven fabric, it is a flexible conductive material processed by the continuous electroless copper-nickel plating, single/double side coated with conductive adhesive and release paper, featured by ultra-thin, highly conductive, electromagnetic shielding, die-cut adaptation, widely used in 5G base stations, flexible displays, TWS headphones and AI-powered computing temperature resistance.

Conductive Fiber

High-performance fiber LCP as a base material, it is a functional fibers made by metallization modification (Cu/Ni/Ag plating) or carbon nanotube doping, comprising, and featured by high conductivity, antistatic, electromagnetic shielding, flexity and spinnability, for electromagnetic shielding and antistatic composite materials.